Schaeffler completes placement of $1.2 billion bond

 

BERLIN – Motion technology firm Schaeffler on Tuesday announced the placement of corporate bonds with a total volume of €1.1 billion ($1.2 billion) with international investors.

Under a current debt issuance programme in two tranches, the German company said a €500 million 4.500% bond will be maturing on August 14, 2026, and the €600 million 4.750% bond will be maturing on August 14, 2029.

The bond issuance was oversubscribed.

The proceeds of the issuance will mainly be used for the refinancing of the previous bridge financing of Vitesco Technologies Group.

BNP Paribas, BofA Securities, Citigroup, and Deutsche Bank acted as joint active book runners for the bond placement.